• Increase in opportunities predicted for high-speed optical transceivers and miniaturized connectivity solutions to address data-intensive applications
• Advances in thermal and power management require investment and innovation in next-gen technologies and emerging industry standards
• Cross-industry collaborations and supply optionality continue to streamline design flexibility and adaptive decision making

LISLE, IL - Media OutReach Newswire - 23 December 2024 - Molex, a global electronics leader and connectivity innovator, predicts an uptick in reliable, durable, high-speed interconnects over the next 12-to-18 months as the impact of generative artificial intelligence (AI), machine learning (ML) and cloud solutions intensifies across every sector, including data centers, automotive, consumer electronics and medical technology.